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| agilent HFBR-5984L 200 mbd low-cost sbcon transceivers in 2 x 5 sff package style data sheet description the HFBR-5984L transceiverfrom agilent provides the system designer with a product to implement the sbcon specification and to be compatible with ibm escon architecture. this transceiver is supplied in the industry standard 2 x 5 sff with an lc fiber connector interface. transmitter sections the transmitter section of theHFBR-5984L utilizes a 1300 nm ingaasp led. this led is packaged in the optical subassembly portion of the transmitter section. it is driven by a custom silicon ic which converts differential pecl logic signals, ecl referenced (shifted) to a +3.3 v supply, into an analog led drive current. features ? multisourced 2 x 5 sff package style with lc receptacle ? single +3.3 v power supply ? wave solder and aqueous wash process compatibility ? manufactured in an iso 9001 certified facility ? sbcon 200 mbd specification applications ? interconnection with ibm ? compatible processors, directors and channel attachment unitsC disk and tape drives C communication controllers ? data communication equipment C local area networksC point-to-point communication receiver sections the receiver section of the HFBR-5984L utilizes an ingaas pin photodiode coupled to a custom silicon transimpedance preamplifier ic. it is packaged in the optical subassembly portion of the receiver. this pin/preamplifier combina- tion is coupled to a customquantizer ic which provides the final pulse shaping for the logic output and the signal detect function. the data output is differential. the signal detect output is single-ended. both data and signal detect outputs are pecl compatible, ecl referenced (shifted) to a +3.3 v power supply. the receiver outputs, data out and data out bar, are squelched at signal detect deassert.
2 figure 1. block diagram. package the overall package concept forthe agilent transceiver consists of three basic elements; the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagram in figure 1. the package outline drawing and pin out are shown infigures 2 and 5. the details of this package outline and pin out are compliant with the multi- source definition of the 2 x 5 sff. the low profile of the agilent transceiver design complies with the maximum height allowed for the lc connector over the entire length of the package. the optical subassemblies utilize a high-volume assembly processtogether with low-cost lens elements which result in a cost- effective building block. the electrical subassembly con- sists of a high volume multilayerprinted circuit board on which the ics and various surface- mounted passive circuit elements are attached. both the receiver and transmitter sections include aninternal shield for the electrical and optical subassemblies to ensure high immunity to external emi fields. data out signal detect data in quantizer ic led driver ic pin photodiode pre-amplifier subassembly led optical subassembly data out data in lc receptacle r x supply t x supply r x ground t x ground the solder posts of the agilent design are isolated from theinternal circuit of the transceiver. the transceiver is attached to a printed circuit board with theten signal pins and the two solder posts which exit the bottom of the housing. the two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the lc connectored fiber cables. 3 figure 2. pin out diagram. pin descriptions: pin 1 receiver signal ground v ee rx: directly connect this pin to thereceiver ground plane. pin 2 receiver power supply v cc rx: provide +3.3 v dc via therecommended receiver power supply filter circuit. locate the power supply filter circuit as close as possible to the v cc rx pin. pin 3 signal detect sd: normal optical input levels tothe receiver result in a logic 1 output. low optical input levels to the receiver result in a fault condition indicated by a logic 0 output. this signal detect output can be used to drive a pecl input onan upstream circuit, such as signal detect input or loss of signal-bar. pin 4 receiver data out bar rd-: no internal terminations areprovided. see recommended circuit schematic. pin 5 receiver data out rd+: no internal terminations areprovided. see recommended circuit schematic. pin 6 transmitter power supply v cc tx: provide +3.3 v dc via therecommended transmitter power supply filter circuit. locate the power supply filter circuit as close as possible to the v cc tx pin. pin 7 transmitter signal ground v ee tx: directly connect this pin to thetransmitter ground plane. pin 8 transmitter disable t dis : no internal connection. optionalfeature for laser based products only. pin 9 transmitter data in td+: no internal terminations areprovided. see recommended circuit schematic. pin 10 transmitter data in bar td-: no internal terminations areprovided. see recommended circuit schematic. mounting studs/solder posts the mounting studs areprovided for transceiver mechanical attachment to the circuit board. it is recommended that the holes in the circuit board be connected to chassis ground. transmitter data in bar transmitter data in transmitter disable (laser based products only) transmitter signal ground transmitter power supply rx tx o o o o o 1 23 4 5 o o o o o 10 9 8 7 6 receiver signal ground receiver power supply signal detect receiver data out bar receiver data out top view mounting studs/solder posts 4 o v e e r x o v c c r x o s d o r d - o r d + z = 50 w z = 50 w terminate at transceiver inputs z = 50 w z = 50 w 10 9 8 7 6 sd lvpecl v cc (+3.3 v) terminate at device inputs lvpecl v cc (+3.3 v) phy device td+ td- rd+ rd- v cc (+3.3 v) 82 w 130 w z = 50 w 1 2 3 4 5 t d - o t d + o n / c o v e e t x o v c c t x o 1 h c2 1 h c1 c3 10 f v cc (+3.3 v) t x r x note: c1 = c2 = c3 = 10 nf or 100 nf 100 w 100 w 130 w 130 w 130 w 130 w figure 3. recommended decoupling and termination circuits application information the applications engineeringgroup is available to assist you with the technical under- standing and design trade-offs associated with these trans- ceivers. you can contact them through your agilent sales representative. the following information is provided to answer some of themost common questions about the use of these parts. transceiver optical power budget versus link lengthoptical power budget (opb) is the available optical power for a fiber optic link to accommodate fiber cable losses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. agilent led technology has produced 1300 nm led deviceswith lower aging characteristics than normally associated with these technologies in the industry. the industry conven- tion is 1.5 db aging for 1300 nm leds. the 1300 nm agilent leds are specified to experience less than 1 db of aging over normal com- mercial equipment mission life periods. contact your agilentsales representative for additional details. recommended handling precautions agilent recommends that normalstatic precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge (esd). the HFBR-5984L series of transceivers meet mil-std-883c method 3015.4 class 2 products. care should be used to avoid shorting the receiver data orsignal detect outputs directly to ground without proper current limiting impedance. solder and wash process compatibilitythe transceivers are delivered with protective process plugs inserted into the lc receptacle. this process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. these transceivers are compat- ible with either industry standard wave or hand solder processes. shipping container the transceiver is packaged in ashipping container designed to protect it from mechanical and esd damage during shipment or storage. board layout - decoupling circuit, ground planes and terminationcircuits it is important to take care in the layout of your circuit board to achieve optimum perform- ance from these transceivers. figure 4 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. it is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. this recommendation is in keeping with good high frequency board layout practices. figures 3 and 4 show two recommended termination schemes. 5 figure 4. alternative termination circuits board layout - hole pattern the agilent transceiver complieswith the circuit board common transceiver footprint hole pattern defined in the original multisource announcement which defined the 2 x 5 sff package style. this drawing is reproduced in figure 6 with the addition of ansi y14.5m compliant dimensioning to be used as a guide in the mechani- cal layout of your circuit board. figure 6 illustrates the recommended panel opening and the position of the circuit board with respect to this panel. board layout - art work the applications engineeringgroup has developed a gerber file artwork for a multilayer printed circuit board layout incorporating the recommenda- tions above. contact your local agilent sales representative for details. regulatory compliance these transceiver products areintended to enable commercial system designers to develop equipment that complies with the various international regulations governing certifica- tion of information technology equipment. see the regulatory compliance table for details. additional information is available from your agilent sales representative. o v e e r x o v c c r x o s d o r d - o r d + z = 50 w 130 w v cc (+3.3 v) 10 nf z = 50 w 130 w 82 w 82 w terminate at transceiver inputs z = 50 w z = 50 w 10 9 8 7 6 sd lvpecl v cc (+3.3 v) terminate at device inputs lvpecl v cc (+3.3 v) phy device td+ td- rd+ rd- z = 50 w 1 2 3 4 5 t d - o t d + o n / c o v e e t x o v c c t x o 1 h c2 1 h c1 c3 10 f v cc (+3.3 v) t x r x note: c1 = c2 = c3 = 10 nf or 100 nf 10 nf 130 w 82 w v cc (+3.3 v) 130 w 82 w v cc (+3.3 v) 82 w 130 w 10 nf 6 figure 5. package outline drawing 7 figure 6. recommended board layout hole pattern and panel opening 8 electrostatic discharge (esd) there are two design cases inwhich immunity to esd damage is important. the first case is during handling of the transceiver prior tomounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these pre-cautions include using grounded wrist straps, work benches, and floor mats in esd controlled areas. the second case to consider is static discharges to the exterior of the equipment chassis con- taining the transceiver parts. to the extent that the lc connector is exposed to the outside of the equipment chassis it may be subject to whatever esd system level test criteria that the equipment is intended to meet. electromagnetic interference (emi) most equipment designs utilizingthis high speed transceiver from agilent will be required to meet the requirements of fcc in the united states, cenelec en55022 (cispr 22) in europe and vcci in japan. this product is suitable for use in designs ranging from adesktop computer with a single transceiver to a concentrator or switch product with a large number of transceivers. immunity equipment utilizing thesetransceivers will be subject to radio-frequency electromagnetic fields in some environments. these transceivers have a high immunity to such fields. for additional information regarding emi, susceptibility, esd and conducted noise testing procedures and results . refer to application note 1166minimizing radiated emissions of high-speed data communications systems . transceiver reliability and performance qualification datathe 2 x 5 sff transceivers have passed agilent reliability and performance qualification testing and are undergoing ongoing quality and reliability monitoring. details are available from your agilent sales representative. regulatory compliance table feature test method performance electrostatic discharge (esd) to the electrical pins jedec/eia jesd22-a114-a and mil-std-883 method 3015 (human body model) meets class 2 (2000 to 3999 volts). withstand up to 3000 v applied between electrical pins. electrostatic discharge (esd) to the lc receptacle variation of iec 61000-4-2 typically withstand at least 25 kv without damage when the lc connector receptacle is contacted by a human body model probe. electromagnetic interference (emi) fcc class b cenelec cen55022 vcci class 2 transceivers typically provide a 10 db margin to the noted standard limits when tested at a certified test range with the transceiver mounted to a circuit card without a chassis enclosure. immunity variation of iec 61000-4-3 typically show no measurable effect from a 10 v/m field swept from 80 to 450 mhz applied to the transceiver when mounted to a circuit card without a chassis enclosure. eye safety ael class 1 en60825-1 (+a11) compliant per agilent testing under single fault conditions. tuv certification #: e9771332-13 ul file #: e173874 these transceivers are manufac- tured at the agilent singaporelocation which is an iso 9001 certified facility. ordering information the HFBR-5984L 1300 nmproduct is available for production orders through the agilent component field sales offices and authorized distributors world wide. for technical information regarding this product, pleasevisit agilent semiconductor products website at www.agilent.com/view/fiber . use the quick search feature tosearch for this part number. you may also contact agilent semiconductor products customer response center at 1-800-235-0312. applications support materials contact your local agilentcomponent field sales office for information on how to obtain pcb layouts and evaluation boards for the 2 x 5 sff transceivers. 9 absolute maximum ratings stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. it should not be assumed that limiting valuesof more than one parameter can be applied to the product at the same time. exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. recommended operating conditions pcb assembly process compatibilitytransmitter electrical characteristics (t c = -20c to +85c, v cc = 2.97 v to 3.63 v) parameter symbol minimum typical maximum unit reference storage temperature t s -40 +100 c lead soldering temperature t sold +260 c lead soldering time t sold 10 sec. supply voltage v cc -0.5 3.6 v data input voltage v i -0.5 v cc v differential input voltage v d 2.0 v note 1 output current i o 50 ma parameter symbol minimum typical maximum unit reference case operating temperature t c -20 +85 c supply voltage v cc 2.97 3.63 v data input voltage - low v il - v cc -1.81 -1.475 v data input voltage - high v ih - v cc -1.165 -0.880 v data and signal detect output load r l 50 w note 2 parameter symbol minimum typical maximum unit reference supply current i cc 133 175 ma note 3 power dissipation p diss 0.45 0.64 w note 4 data input current - low i il -350 -2 a data input current - high i ih 18 350 a parameter symbol minimum typical maximum unit reference hand lead soldering temperature time t solder t time +260 10 c sec wave soldering and aqueous wash temperature time t solder t time +260 10 c sec 1 1 aqueous wash pressure 110 psi 10 receiver electrical characteristics (t c = -20c to +85c, v cc = 2.97 v to 3.63 v) transmitter optical characteristics (t c = -20c to +85c, v cc = 2.97 v to 3.63 v) receiver optical characteristics (t c = -20c to +85c, v cc = 2.97 v to 3.63 v) parameter symbol minimum typical maximum unit reference output optical power bol 62.5/125 m, na = 0.275 fiber eol p o -19.5 -20.5 -16.0 -16.0 -14.0 -14.0 dbm avg. note 8 optical extinction ratio 8 db note 9 center wavelength l c 1280 1380 nm figure 7 spectral width - fwhm dl 147 175 nm note 10 figure 7 optical rise time t r 1 1.7 ns note 11, 12 figure 7 optical fall time t f 1.2 1.7 ns note 11, 12 figure 7 total jitter tj 0.2 0.8 ns note 13 parameter symbol minimum typical maximum unit reference input optical power minimum at window edge p in min. (w) pin min (c) +1 db dbm avg. note 14 figure 8 input optical power minimum at eye center p in min. (c) -29 dbm avg. note 15 figure 8 input optical power maximum p in max. -14 dbm avg. note 14 operating wavelength l 1280 1380 nm systematic jitter sj 0.2 1.0 ns note 16 eyewidth t ew 1.4 ns note 17 signal detect - asserted p a -44.5 -35.5 dbm avg. note 18 signal detect - deasserted p d -45 -36 dbm avg. note 19 signal detect - hysteresis p a - p d 0.5 4.0 db signal detect assert time (off to on) t a 0 500 s note 20 signal detect deassert time (on to off) t d 0 500 s note 21 parameter symbol minimum typical maximum unit reference supply current i cc 65 125 ma note 5 power dissipation p diss 0.25 0.46 w note 4 data output voltage - low v ol - v cc -1.86 -1.62 v note 6 data output voltage - high v oh - v cc -1.10 -0.86 v note 6 data output rise time t r 0.35 1.3 ns note 7 data output fall time t f 0.35 1.3 ns note 7 signal detect output voltage - low v ol - v cc -1.86 -1.62 v note 6 signal detect output voltage - high v oh - v cc -1.10 -0.86 v note 6 signal detect output rise time t r 0.35 2.2 ns note 7 signal detect output fall time t f 0.35 2.2 ns note 7 11 notes: 1. this is the maximum voltage that can be applied across the differential transmitter data inputs to prevent damage to the inputesd protection circuit. 2. the outputs are terminated with 50 w connected to v cc C2 v. 3. the power supply current needed to operate the transmitter is provided to differential ecl circuitry. this circuitry maintains anearly constant current flow from the power supply. constant current operation helps to prevent unwanted electrical noise frombeing generated and conducted or emitted to neighboring circuitry. 4. the power dissipation value is the power dissipated in the receiver itself. power dissipation is calculated as the sum of the products of supply voltage and currents,minus the sum of the products of the output voltages and currents. 5. this value is measured with the outputs terminated into 50 w connected to v cc C2 v and an input optical power level of C14.5 dbm average. 6. this value is measured with respect to v cc with the output terminated into 50 w connected to v cc C2 v. 7. the output rise time and fall times are measured between 20% and 80% levels with the output connected tov cc C 2 v through 50 w. 8. these optical power values are measured with the following conditions: ? the beginning of life (bol) to the end of life (eol) optical power degradation is assumed to be 1.5 dbper the industry convention for long wavelength leds. the actual degradation observed in normalcommercial environments will be <1.0 db with agilents 1300 nm led products. ? over the specified operating voltage and temperature ranges. ? input signal: 1010 data pattern, 200 mb/s nrz code. 9. the extinction ratio is a measure of the modulation depth of the optical signal. the data 0 output optical power is comparedto the data 1 peak output optical and expressed in decibels. with the transmitter driven by a halt line state (12.5 mhzsquare-wave) signal, the average optical power is measured. the data 1 peak power is then calculated by adding 3 db tothe measured average optical power. the data 0 output optical power is found by measuring the optical power when thetransmitter is driven by a logic 0 input. the extinction ratio is the ratio of the optical power at the 0 level compared tothe optical power at the 1 level expressed in decibels. 10. from an assumed gaussian-shaped wavelength distribution, the relationship between fwhm and rms values for spectral width is 2.35 x rms = fwhm. 11. input conditions: 100 mhz, square wave signal, input voltages are in the range specified for v il and v ih . 12. measured with electrical input signal rise and fall time of 0.35 to 1.3 ns (20-80%) at the transmitter input pins. optical output riseand fall times are measured between 20% and 80% levels. 13. transmitter systematic jitter is equal to the sum of duty cycle distortion (dcd) and data dependent jitter (ddj). dcd is equivalent to pulse-width distortion (pwd).systematic jitter is measured at the 50% signal level with 200 mbd, prbs 2 7 C1 electrical input data pattern. 14. this specification is intended to indicate the performance of the receiver section of the transceiver when input optical powersignal characteristics are present per the following conditions. the input optical power dynamic range from the minimumlevel (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide outputdata with a bit error ratio (ber) better than or equal to 10 C12 . ? at the beginning of life (bol). ? over the specified operating temperature and voltage ranges. ? receiver data window time-width is 1.4 ns or greater and centered at mid-symbol. ? input signal is 200 mbd, pseudo random-bit-stream 2 7 C1 data pattern. ? transmitter cross-talk effects have been included in receiver sensitivity. transmitter should be running at 50% duty cycle (nominal) between8 - 200 mb/s, while receiver sensitivity is measured. 15. all conditions of note 14 apply except that the measurement is made at the center of the symbol with no window time-width andwith a ber better than or equal to 10 -15 . 16. the receiver systematic jitter specification applies to optical powersbetween C14.5 dbm avg. to C27.0 dbm avg. at the receiver. receiver systematic jitter is equal to the sum of duty cycle distortion(dcd) and data dependent jitter (ddj). dcd is equivalent to pulse-width distortion (pwd). systematic jitter is measured at the50% signal level with 200 mbd, prbs 2 7 C1 electrical output data pattern. 17. eye-width specified defines the minimum clock time-position range, centered around the center of the 5 ns baud interval, at which the ber must be 10 C12 or better. test data pattern is prbs 2 7 C1. the typical change in input optical power to open the eye to 1.4 nsec from a closed eye is less than 1.0 db. 18. status flag switching thresholds: direction of decreasing optical power: if power >C36.0 dbm avg., then sf = 1 (high)if power |
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